…Die Attach Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes. For devices…
…the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the highest productivity by eliminating wasted…
…a recipe-defined thermal profile during the entire curing cycle. A typical PCO temperature and Pressure profile. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping…
…engineering. On the factory floor, employee empowerment ensures that product or process improvements are documented, communicated and implemented. The interaction of these processes has led us to produce equipment characterized…
…keep your account password secure. You agree to notify us immediately of any unauthorized use of your account or other breach of security. You may not use another’s account without…
…fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
…most commonly used in power device packaging and semiconductor bumping and die attach applications, although it is suitable for other applications where the use of flux is undesired. Formic acid…
…provide cure cycles as long as four hours. A versatile curing oven with configurations available for various pallet sizes. Oven Size: 755 K3- 1900 (L) x 1620 (W) x 2000…
May 1, 2025 Embassy Suites by Hilton, Olathe, Kansas Diễn đàn STAR (Thương mại chiến lược và Nghiên cứu tiên tiến) là sự kiện tập trung do SMTA tổ chức,…
