…Die Attach Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes. For devices…
…strategically concentrates on two key factors to satisfy the Industry 4.0 requirement for Reflow Soldering Equipment: Communication software: Machines have two protocols for semiconductor equipment communication standard/generic equipment model (SEC/GEM)…
Pages Network Usa Chính sách riêng tư Công ty Markets smt-equipment reflow soldering problems？ reflow oven manufacturer Công ty đi đầu về xử lý nhiệt độ Reflow Soldering Equipment Company…
Technically advanced, high-quality products and unmatched customer focus reinforce company’s market share leadership. Based on its recent analysis of the surface mount technology (SMT) reflow soldering equipment market, Frost &…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
The 2021 Service Excellence Award for Soldering Equipment was won by Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers….
The 2021 Service Excellence Award for Soldering Equipment was won by Heller Industries. Circuits Assembly recognizes companies that receive the highest customer service ratings, as judged by their own customers….
…company’s equipment.” Hơn nữa, để khai thác nhu cầu khổng lồ của nền Công nghiệp 4.0, công ty không để mất bất kỳ cơ hội nào để phát huy khả…
…in-line cho die-attach, flip chip, underfill và những ứng dụng đóng gói COB. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners…
