…Die Attach Bumping and die attach (also known as flip chip die attach) are essential steps to wafer-level or board-level semiconductor advanced packaging which require separate reflow processes. For devices…
…dẫn Reflow Soldering & Semiconductor Curing – Heller Reflow Soldering – Heller What Are Reflow Soldering Defects Lỗi chì vón cục Lỗi thiếu chì Lỗi wicking Tombstoning PCB Soldering Problems…
…4.0 requirements have set it apart from the competition. The innovative soldering equipment boasts highly flexible customization capability, which allows it to addresses demanding customer needs of high accuracy soldering…
…overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks: Flux can outgas during the reflow process creating solder voids. Flux leaves behind a…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
…Reflow Soldering Oven 360 cm (142″) 7 Top 7 Bottom 1 Top (std.) External Cool optional 1505 MK5 SMT Reflow Soldering Oven 200 cm (79″) 5 TOP 5 BOTTOM 1…
…in-line cho die-attach, flip chip, underfill và những ứng dụng đóng gói COB. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners…
May 1, 2025 Embassy Suites by Hilton, Olathe, Kansas Diễn đàn STAR (Thương mại chiến lược và Nghiên cứu tiên tiến) là sự kiện tập trung do SMTA tổ chức,…
…soldering process on the SMT line have given it a commanding position in the SMT soldering equipment market,” said Frost & Sullivan Research Analyst Nupur Sinha. “Its products have established…
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