…wicking, and reduced solder voiding. More formic reflow information. Underfill Curing Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller curing ovens have…
…flux residue has the potential be trapped between interconnects, blocking underfill flow. This results in underfill voids and causes reduced reliability Formic Acid Replaces the Need for Flux Fluxless reflow…
…in-line cho die-attach, flip chip, underfill và những ứng dụng đóng gói COB. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
…machines not only the premier reflow soldering machine system but the best overall reflow oven value in the industry! Những tiến bộ như phát minh ra hệ thống phân tách…
…40% chi phí điện năng! Lead Free Reflow Oven More Lead free product has been run on our reflow machines than any other type of reflow machine! We have pioneered…
…a recipe-defined thermal profile during the entire curing cycle. A typical PCO temperature and Pressure profile. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
2043 MK7 Reflow Oven Machine The 2043 MK7 reflow oven machine is an ultra-high volume reflow oven with 13 heated zones and belt speeds up to 1.88m/min. The 2043…
…oven improves quality and reduces costs: Small footprint – overall length (200 cm) of this reflow oven is similar size to benchtop reflow machines but is IN-LINE for maximum throughput!…
