…wicking, and reduced solder voiding. More formic reflow information. Underfill Curing Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller curing ovens have…
Heller Industries Network in Germany Germany Representative Network MULTI COMPONENTS GmbH, Roßtaler Str. 7, D-91126 Schwabach, Deutschland Tel: +49 (0)9122 9302 0info@multi-components.dewww.multi-components.de…
Heller Industries Network in Austria Austria Representative Network MULTI COMPONENTS GmbH, Roßtaler Str. 7, D-91126 Schwabach, Deutschland Tel: +49 (0)9122 9302 info@multi-components.de www.multi-components.de…
…in-line cho die-attach, flip chip, underfill và những ứng dụng đóng gói COB. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners…
…flux residue has the potential be trapped between interconnects, blocking underfill flow. This results in underfill voids and causes reduced reliability Formic Acid Replaces the Need for Flux Fluxless reflow…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
…design-related causes of component cracking: Chế tạo linh kiện không đúng cách Thiết kế linh kiện không phù hợp Đóng gói PCB không đúng cách trong quá trình vận chuyển…
…a recipe-defined thermal profile during the entire curing cycle. A typical PCO temperature and Pressure profile. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
…chamber transfer times. Dual rail conveyors are also available for additional throughput. No Shifting Parts The smooth-travel conveyor system ensures that components are not shifted or moved during travel throughout…
