Issues from using Flux
Traditionally, using flux was a necessary part of soldering. Flux helps to remove oxides from the metals being solder, improving the overall wettability of solder needed for high quality solder joints. Using flux, however, has its drawbacks:
Formic Acid Replaces the Need for Flux
How Does Formic Acid Reflow Work for fluxless soldering?
The chemistry involved with formic acid reflow is a two-step process:
Step 1 : Metal formate is created (between 150C – 200C)
Step 2 : Metal formate decomposes leaving behind pure metal (Above 200C)
Formic Acid Reflow
Formic acid can be incorporated into most reflow profiles, but is recommended when peak temperatures are below 350C. It is most commonly used in power device packaging and semiconductor bumping and die attach applications, although it is suitable for other applications where the use of flux is undesired. Formic acid reflow is often combined with vacuum assisted reflow for enhanced void removal. For more information on Heller’s formic and vacuum machines, click here.
Forming Gas Reflow
We also offers forming gas as a process gas option for fluxless soldering reflow. Forming gas is a mixture of typically 4-5% Hydrogen and Nitrogen, and has the ability to act as a flux substitute for high temperature (generally >350C) reflow applications. If you are looking for a fluxless process with a high temperature profile, forming gas is the ideal fluxless option.
Click here to learn more about our formic reflow ovens
4 Vreeland Road,
Florham Park, NJ 07932, USA