…wicking, and reduced solder voiding. More formic reflow information. Underfill Curing Heller offers several types of curing ovens suitable for both device-level and board-level underfill curing. Heller curing ovens have…
…a recipe-defined thermal profile during the entire curing cycle. A typical PCO temperature and Pressure profile. Typical PCO Applications Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping…
…the epoxy cure process produces immediate, significant benefits in productivity, quality, and floor space reduction. Higher Productivity with In-line Processing & In-line processing provides the highest productivity by eliminating wasted…
…in-line cho die-attach, flip chip, underfill và những ứng dụng đóng gói COB. Developing line of pressure curing ovens for void free epoxy and underfill curing. Working with industry partners…
…flux residue has the potential be trapped between interconnects, blocking underfill flow. This results in underfill voids and causes reduced reliability Formic Acid Replaces the Need for Flux Fluxless reflow…
…dụng DIE ATTACH và UNDERFILL PCO bơm khí nén vào trong nồi hơi, sau đó gia nhiệt và làm nguội bằng sự đối lưu không khí cưỡng bức.. Các điện…
…provide cure cycles as long as four hours. A versatile curing oven with configurations available for various pallet sizes. Oven Size: 755 K3- 1900 (L) x 1620 (W) x 2000…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
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…(mm): 1874(L) x 1150(W) x 2256(H) Single Column, 2 Heated Zones 22 Tray Capacity (22 Up + Down) Shelf Pitch 38.1mm Cure Time: Up to 60 minutes Max Zone Temperature…
