Semiconductor manufacturing autoclave autoclave temperature curing oven for composites curing oven for epoxy Curing oven for powder coating Reflow Soldering fluxless reflow soldering jedec reflow profile jedec reflow standard led…
…reflow heat source, and repond in Iess than half a second to temperature changes of less than 0.1 C thus maintaining the highest level of temperature repeatability. Heller’s heater modules…
…void free. Pressure Curing Oven Process A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for a variety of bonding and curing application….
…Curing ovens with a pressure chamber, also referred to as autoclaves, for void-free curing applications. Other Curing Ovens Curing ovens suitable for application involving magazine loading. Our global customer base…
…easier access for oven operators. All skins have double insulation to save up to 10-15% in energy losts. PID temperature control to ensure zone temperature stability to +/- 1°C Signal…
…substitute for high temperature (generally >350C) reflow applications. If you are looking for a fluxless process with a high temperature profile, forming gas is the ideal fluxless option. Click here…
…for a given temperature. Formic acid vapor concentration in the oven can be varied by bubbler temperature and nitrogen flow through bubbler Auto refill system ensures bubbler never drops below…
…Top, 5 Bottom Number of cooling zones: 1 Heated length: 132 cm Min/Max Board width:50-610 mm Maximum conveyor speed: 188 cm/min Temperature range: 60-350 °C Accuracy of Temperature Controller: ±0,1…
…response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen. Oven Length 465cm Process Gas…
…multi-step pump down IR Heated Vacuum Chamber Infra-red heaters allow for peak temperatures to be reached inside the vacuum chamber for shorter times above liquidus and more process flexibility. High…
