…Die Attach Curing Underfill Curing Ag Sintering Cure MEMS Sealing Taping / Lamination PCB Via Fill Encapsulation Curing Composite Forming Click here to learn more about our pressure curing ovens…
…curing ovens offer high pallet size flexibility at high UPH. Vertical Curing Ovens In-line curing ovens with a vertical form-factor for a reduced footprint and high UPH. Pressure Curing Ovens…
…hàn áp suất Batch Pressure Curing Oven for 300mm Wafers Pressure Curing Oven PCO 700 Pressure Curing Oven – PCO 1150 In-line Pressure Curing Oven – PCO 1280 Lò bảo…
VCO 755-350 Vertical Curing Oven Vertical Curing Oven with Cleanroom Ability Vertical curing oven with optional cleanroom capability able to handle boards or pallets up to 350mm x 350mm in…
Vertical Curing Oven VCO 722 Small Footprint Vertical Curing Oven A small footprint vertical curing oven with a single column requiring less than 4 feet of cleanroom space. Oven Size…
In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x…
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]…
Pressure Curing Oven – PCO 1150 Manual loading PCO for curing PLP panels. Oven Size (mm): 2,000[W] x 2,300[D] x 2,300[H] Max Operating Pressure: 10 bar (145 psi) Max Operating…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
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