Home » Máy hàn áp suất » Batch Pressure Curing Oven for 300mm Wafers

Manual Batch Pressure Curing Oven – PCO 500

Batch Pressure Curing Oven for 300mm Wafers photo

Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers.

  • Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]
  • Chamber Usable Area (mm): 350[L] x 350[W] x 227[H]
  • Max Operating Pressure: 12 Bar (174 psi)
  • Max Operating Temperature:
    • 200⁰ C (Forced Air Convection)
    • 350⁰ C (Conduction Plate Option)
  • Manual Loading
  • External Chiller Option
Batch Pressure Curing Oven for 300mm Wafers pic

Optional conduction plate inside pressure chamber.

Batch Pressure Curing Oven for 300mm Wafers pic

System Air Flow (Top Down)

Home Email Phone Search
×
Heller Industries, Inc.

4 Vreeland Road,
Florham Park, NJ 07932, USA

Contact Us

1-973-377-6800
help@hellerindustries.com