…hàn áp suất Batch Pressure Curing Oven for 300mm Wafers Pressure Curing Oven PCO 700 Pressure Curing Oven – PCO 1150 In-line Pressure Curing Oven – PCO 1280 Lò bảo…
…void free. Pressure Curing Oven Process A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for a variety of bonding and curing application….
…Manual loading batch Pressure Curing Ovens for magazines PCO 1150 Manual loading Pressure Curing Ovens for curing PLP glass panels PCO 1280 In-line Pressure Curing Ovens with dual loaders and…
…curing ovens offer high pallet size flexibility at high UPH. Vertical Curing Ovens In-line curing ovens with a vertical form-factor for a reduced footprint and high UPH. Pressure Curing Ovens…
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]…
In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x…
…ensure optimal heat dissipation ability. Heller offers 3 solutions of this application: pressure curing ovens (PCO), pressure reflow ovens (PRO), and formic reflow ovens. All three solutions have proven void…
Pressure Curing Oven – PCO 1150 Manual loading PCO for curing PLP panels. Oven Size (mm): 2,000[W] x 2,300[D] x 2,300[H] Max Operating Pressure: 10 bar (145 psi) Max Operating…
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
Pressure Curing Oven – PCO 700 Oven Size (mm): 1,800[L] x 1,350[W] x 1,750[H] Chamber Usable Area (mm): 500[L] x 460[W] x 460[H] Max Operating Pressure: 8 bar (116 psi)…
