…hàn áp suất Batch Pressure Curing Oven for 300mm Wafers Pressure Curing Oven PCO 700 Pressure Curing Oven – PCO 1150 In-line Pressure Curing Oven – PCO 1280 Lò bảo…
…void free. Pressure Curing Oven Process A Pressure Cure Oven (PCO), or Autoclave, is used to minimize voiding and increase adhesion strength for a variety of bonding and curing application….
…DIE ATTACH và UNDERFILL Heller 860 Pressure Curing Oven (PCO) Back-end semiconductor curing oven summary: Các mẫu máy sấy khô Chu kỳ/ tốc độ băng tải 755 Mini Vertical Oven…
…Manual loading batch Pressure Curing Ovens for magazines PCO 1150 Manual loading Pressure Curing Ovens for curing PLP glass panels PCO 1280 In-line Pressure Curing Ovens with dual loaders and…
…reflow oven technology. Today, the company also excels at semiconductor packaging and epoxy curing, making it a one-stop destination for thermal processing solutions on an international level. The organization offers…
…ensure optimal heat dissipation ability. Heller offers 3 solutions of this application: pressure curing ovens (PCO), pressure reflow ovens (PRO), and formic reflow ovens. All three solutions have proven void…
Manual Batch Pressure Curing Oven – PCO 500 Manual loading Batch Pressure Curing Oven with conduction heating plate option for 300mm wafers. Oven Size (mm): 1,800[L] x 1,400[W] x 1,700[H]…
In-line Pressure Curing Oven – PCO 1280 In-line Pressure Curing Oven with dual loaders and 2 magazine capacity used for curing PLP panels. Oven Size (mm): 2,000[W] x 4,850[D] x…
Pressure Curing Oven – PCO 1150 Manual loading PCO for curing PLP panels. Oven Size (mm): 2,000[W] x 2,300[D] x 2,300[H] Max Operating Pressure: 10 bar (145 psi) Max Operating…
Pressure Curing Oven – PCO 700 Oven Size (mm): 1,800[L] x 1,350[W] x 1,750[H] Chamber Usable Area (mm): 500[L] x 460[W] x 460[H] Max Operating Pressure: 8 bar (116 psi)…
